演讲摘要：

精密微细、低损低热、三维选择，这些独一无二的优势，使得超快激光微加工在消费电子、半导体、生物医疗、航空航天等产业日益得到应用。在上述应用领域，超快激光微加工面临着如何进一步提高加工质量、提高加工效率、扩大应用范围等挑战。本报告主要介绍超快激光精密加工技术在上述领域的应用案例、工艺特点以及未来发展。 With the unique advantages of precision, less material loss, low heat input and three-dimensional selection, ultrafast laser micromachining has been applied in consumer electronics, semiconductor, biomedical, aerospace and other industries. In the above application fields, ultrafast laser micromachining is facing the challenges of how to further improve the quality of processing, improve the efficiency of processing and expand the application range. This report mainly introduces the application cases, process characteristics and future trends of ultrafast laser micromachining in the above fields.